South Korea’s Lee says Samsung chip packaging expansion to spur $30 billion additional investment

SEOUL, Nov 12 (Reuters) - South Korean President Lee Jae Myung said on Thursday that Samsung Electronics’ 6 trillion won ($4.48 billion) investment in a high-bandwidth memory chip packaging plant in Asan, South Korea, would be followed by about 40 trillion won in investment in advanced equipment.

($1 = 1,339.5500 won)